LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1025CS8#TRPBF (Engineering Calculation) SOIC  
(printed on: 2020-05-28 23:38:23) TOTAL MASS (g): 0.073278
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001950 1000000 26611.0410156
Die Coat Dow Corning Silicone 69430-27-9 0.000081 1000000 1105.38171387
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.014071 580000 192022.546875
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.010189 420000 139046.109375
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.024260 1000000 331068.625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001477 1000000 20154.1386719
External Plating Total: 0.001477 1000000 20154.1386719
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000194 1000000 2647.45751953
Internal Plating Total: 0.000194 1000000 2647.45751953
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000680 750000 9279.74707031
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000227 250000 3097.7980957
Die Attach Total: 0.000907 1000000 12377.5449219
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006634 150000 90532.1328125
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036263 820000 494869.84375
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001106 25000 15093.2373047
Carbon Black (C) 1333-86-4 0.000221 5000 3015.91796875
Encapsulation Total: 0.044224 1000000 603511.125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000185 1000000 2524.63720703
  TOTAL MASS (g): 0.073278