LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1054IS8#PBF (Engineering Calculation) SOIC  
(printed on: 2020-04-04 14:53:57) TOTAL MASS (g): 0.076299
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.004209 1000000 55164.65625
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.023653 975000 310004.65625
Iron (Fe) 7439-89-6 0.000582 24000 7627.89990234
Phosphorus (P) 7723-14-0 0.000007 300 91.7444992065
Zinc (Zn) 7440-66-6 0.000017 700 222.808074951
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.024259 1000000 317947.09375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001477 1000000 19356.1484375
External Plating Total: 0.001477 1000000 19356.1484375
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000194 1000000 2542.63305664
Internal Plating Total: 0.000194 1000000 2542.63305664
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001150 750000 15072.3105469
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000383 250000 5019.734375
Die Attach Total: 0.001533 1000000 20092.0449219
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006657 150000 87249.015625
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036392 820000 476966.53125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001110 25000 14548.0546875
Carbon Black (C) 1333-86-4 0.000222 5000 2909.61132812
Encapsulation Total: 0.044381 1000000 581673.1875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000246 1000000 3224.16381836
  TOTAL MASS (g): 0.076299