LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1057CN8#PBF (Engineering Calculation) PDIP  
(printed on: 2020-06-01 21:12:46) TOTAL MASS (g): 0.500665
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.003700 1000000 7390.16650391
Die Coat Dow Corning Silicone 69430-27-9 0.000886 1000000 1769.64526367
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.089088 580000 177939.234375
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.064512 420000 128852.546875
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.153600 1000000 306791.78125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.012410 1000000 24787.5996094
External Plating Total: 0.012410 1000000 24787.5996094
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.001228 1000000 2452.73657227
Internal Plating Total: 0.001228 1000000 2452.73657227
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001044 750000 2085.2253418
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000348 250000 695.075134277
Die Attach Total: 0.001392 1000000 2780.30053711
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.044167 135000 88216.6171875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.281360 860000 561972.25
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.001636 5000 3267.65209961
Encapsulation Total: 0.327163 1000000 653456.5
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000286 1000000 571.239929199
  TOTAL MASS (g): 0.500665