LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1079CN#PBF (Engineering Calculation) PDIP  
(printed on: 2020-05-29 00:52:34) TOTAL MASS (g): 0.986764
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.003584 1000000 3632.07495117
Die Coat Dow Corning Silicone 69430-27-9 0.000858 1000000 869.509033203
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.169128 580000 171396.640625
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.122472 420000 124114.8125
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.291600 1000000 295511.46875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.021727 1000000 22018.2011719
External Plating Total: 0.021727 1000000 22018.2011719
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.002333 1000000 2364.29443359
Internal Plating Total: 0.002333 1000000 2364.29443359
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001021 750000 1034.69543457
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000340 250000 344.560699463
Die Attach Total: 0.001361 1000000 1379.25610352
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.089748 135000 90951.859375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.571729 860000 579398.0625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.003324 5000 3368.5871582
Encapsulation Total: 0.664801 1000000 673718.5
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000500 1000000 506.706878662
  TOTAL MASS (g): 0.986764