LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1129MPST-3.3#PBF (Engineering Calculation) SOT-223  
(printed on: 2020-06-01 20:50:51) TOTAL MASS (g): 0.117015
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002887 1000000 24671.96875
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.062693 975000 535767.125
Iron (Fe) 7439-89-6 0.001543 24000 13186.2988281
Phosphorus (P) 7723-14-0 0.000019 300 162.371795654
Zinc (Zn) 7440-66-6 0.000045 700 384.564788818
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.064300 1000000 549500.375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001609 1000000 13753.6611328
External Plating Total: 0.001609 1000000 13753.6611328
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000514 1000000 4392.58496094
Internal Plating Total: 0.000514 1000000 4392.58496094
Die Attach Solder Wire Dia 0.3mm *100m 95Pb/5Sn Silver (Ag) 7440-22-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000078 50000 666.578918457
Lead (Pb) 7439-92-1 0.001478 950000 12630.8164062
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000000 0 0
Die Attach Total: 0.001556 1000000 13297.3955078
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.004738 103000 40490.3984375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.041170 895000 351834.0625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000092 2000 786.221374512
Encapsulation Total: 0.046000 1000000 393110.6875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000149 1000000 1273.33666992
  TOTAL MASS (g): 0.117015