LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1133ACSW#PBF (Engineering Calculation) SOIC WIDE  
(printed on: 2020-05-29 00:14:36) TOTAL MASS (g): 0.641052
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.006187 1000000 9651.31542969
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.139415 975000 217478.296875
Iron (Fe) 7439-89-6 0.003432 24000 5353.69580078
Phosphorus (P) 7723-14-0 0.000043 300 67.0771942139
Zinc (Zn) 7440-66-6 0.000100 700 155.993453979
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.142990 1000000 223055.046875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.007167 1000000 11180.7783203
External Plating Total: 0.007167 1000000 11180.7783203
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.001144 1000000 1784.56530762
Internal Plating Total: 0.001144 1000000 1784.56530762
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001544 750000 2408.5390625
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000515 250000 803.366394043
Die Attach Total: 0.002059 1000000 3211.90576172
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.049522 103000 77251.0859375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.430316 895000 671264.8125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000962 2000 1500.65722656
Encapsulation Total: 0.480800 1000000 750016.5625
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000705 1000000 1099.75402832
  TOTAL MASS (g): 0.641052