LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1167CS8-1#PBF (Engineering Calculation) SOIC  
(printed on: 2020-06-01 20:41:39) TOTAL MASS (g): 0.074491
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.004619 1000000 62007.6132812
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.012824 580000 172155.359375
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.009286 420000 124659.601562
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.022110 1000000 296814.96875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001477 1000000 19825.9511719
External Plating Total: 0.001477 1000000 19825.9511719
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000068 1000000 912.863769531
Internal Plating Total: 0.000068 1000000 912.863769531
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001238 750000 16619.4902344
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000413 250000 5544.3046875
Die Attach Total: 0.001651 1000000 22163.7949219
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006657 150000 89366.6796875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036392 820000 488543.21875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001110 25000 14901.1572266
Carbon Black (C) 1333-86-4 0.000222 5000 2980.23168945
Encapsulation Total: 0.044381 1000000 595791.25
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000185 1000000 2483.52636719
  TOTAL MASS (g): 0.074491