LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1210CT7#PBF (Engineering Calculation) TO-220  
(printed on: 2020-07-10 06:10:21) TOTAL MASS (g): 2.023178
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.004913 1000000 2428.35717773
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 1.457910 998500 720603.75
Iron (Fe) 7439-89-6 0.000000 0 0
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.002190 1500 1082.4552002
Lead Frame Total: 1.460100 1000000 721686.3125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.012534 1000000 6195.35498047
External Plating Total: 0.012534 1000000 6195.35498047
Inter. Plating Ni 7440-02-0 0.017000 893796 8402.62109375
Inter. Plating Ag 7440-22-4 0.002020 106203.992188 998.429016113
Internal Plating Total: 0.019020 1000000 9401.04980469
Die Attach 95Pb / 5 Sn Silver (Ag) 7440-22-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000114 50000 56.346988678
Lead (Pb) 7439-92-1 0.002175 950000 1075.0411377
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000000 0 0
Die Attach Total: 0.002289 1000000 1131.38818359
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.053828 103000 26605.6640625
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.467727 895000 231184.28125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.001045 2000 516.514038086
Encapsulation Total: 0.522600 1000000 258306.4375
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.001722 1000000 851.135986328
  TOTAL MASS (g): 2.023178