LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1211CN8#PBF (Engineering Calculation) PDIP  
(printed on: 2020-05-28 22:52:25) TOTAL MASS (g): 0.500529
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.003683 1000000 7358.2109375
Die Coat Dow Corning Silicone 69430-27-9 0.000882 1000000 1762.13476562
Lead Frame Cu Copper (Cu) 7440-50-8 0.149760 975000 299203.25
Iron (Fe) 7439-89-6 0.003686 24000 7364.20410156
Phosphorus (P) 7723-14-0 0.000046 300 91.9027175903
Zinc (Zn) 7440-66-6 0.000108 700 215.771591187
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.153600 1000000 306875.15625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.012410 1000000 24794.3339844
External Plating Total: 0.012410 1000000 24794.3339844
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.001228 1000000 2453.40283203
Internal Plating Total: 0.001228 1000000 2453.40283203
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001042 750000 2081.79638672
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000347 250000 693.266113281
Die Attach Total: 0.001389 1000000 2775.06225586
Encapsulation FILLED EPOXY RESIN Resin (EP)   0.078520 240000 156873.9375
Bromine (Br) 40039-93-8 0.003272 10000 6537.07958984
Silica (SiO2) 60676-86-0 0.235561 720000 470623.78125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.009815 30000 19609.2421875
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000000 0 0
Encapsulation Total: 0.327168 1000000 653644
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000169 1000000 337.642578125
  TOTAL MASS (g): 0.500529