LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1355CS8#TRPBF (Engineering Calculation) SOIC  
(printed on: 2020-05-28 22:58:11) TOTAL MASS (g): 0.075452
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.003703 1000000 49077.65625
Die Coat Dow Corning Silicone 69430-27-9 0.000154 1000000 2041.03674316
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.014071 580000 186489.796875
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.010189 420000 135039.765625
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.024260 1000000 321529.53125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001477 1000000 19573.4375
External Plating Total: 0.001477 1000000 19573.4375
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000194 1000000 2571.17602539
Internal Plating Total: 0.000194 1000000 2571.17602539
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001048 750000 13889.6513672
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000349 250000 4625.46679688
Die Attach Total: 0.001397 1000000 18515.1191406
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006612 150000 87632.046875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036148 820000 479087
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001102 25000 14605.3408203
Carbon Black (C) 1333-86-4 0.000220 5000 2915.7668457
Encapsulation Total: 0.044082 1000000 584240.125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000185 1000000 2451.89477539
  TOTAL MASS (g): 0.075452