LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1369CS#PBF (Engineering Calculation) SOIC  
(printed on: 2020-06-01 21:44:45) TOTAL MASS (g): 0.13539
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.004216 1000000 31139.5683594
Die Coat Dow Corning Silicone 69430-27-9 0.000176 1000000 1299.94396973
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.025972 580000 191830.359375
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.018808 420000 138916.75
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.044780 1000000 330747.125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.002585 1000000 19096.1601562
External Plating Total: 0.002585 1000000 19096.1601562
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000358 1000000 2644.2043457
Internal Plating Total: 0.000358 1000000 2644.2043457
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001155 750000 8530.88183594
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000385 250000 2843.62744141
Die Attach Total: 0.001540 1000000 11374.5097656
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.010580 130000 78144.359375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.067547 830000 498905.25
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.002848 35000 21035.4589844
Carbon Black (C) 1333-86-4 0.000407 5000 3006.12060547
Encapsulation Total: 0.081382 1000000 601091.125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000353 1000000 2607.27416992
  TOTAL MASS (g): 0.135390