LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1461CIS8-3#PBF (Engineering Calculation) SOIC  
(printed on: 2020-05-29 00:19:58) TOTAL MASS (g): 0.076018
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.004033 1000000 53053.3320312
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.014071 580000 185101.25
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.010189 420000 134034.3125
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.024260 1000000 319135.5625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001477 1000000 19427.6992188
External Plating Total: 0.001477 1000000 19427.6992188
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000194 1000000 2552.03222656
Internal Plating Total: 0.000194 1000000 2552.03222656
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001116 750000 14680.7626953
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000372 250000 4893.58789062
Die Attach Total: 0.001488 1000000 19574.3515625
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006657 150000 87571.5390625
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036392 820000 478729.65625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001110 25000 14601.8330078
Carbon Black (C) 1333-86-4 0.000222 5000 2920.36694336
Encapsulation Total: 0.044381 1000000 583823.375
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000185 1000000 2433.63891602
  TOTAL MASS (g): 0.076018