LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1490ACN8#PBF (Engineering Calculation) PDIP  
(printed on: 2020-06-01 21:59:01) TOTAL MASS (g): 0.498766
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001976 1000000 3961.77539062
Die Coat Dow Corning Silicone 69430-27-9 0.000110 1000000 220.544189453
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.089088 580000 178616.734375
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.064512 420000 129343.148438
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.153600 1000000 307959.875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.012410 1000000 24881.9765625
External Plating Total: 0.012410 1000000 24881.9765625
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.001228 1000000 2462.07519531
Internal Plating Total: 0.001228 1000000 2462.07519531
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000686 750000 1375.39367676
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000229 250000 459.132904053
Die Attach Total: 0.000915 1000000 1834.52648926
Encapsulation FILLED EPOXY RESIN Resin (EP)   0.078778 240000 157945.71875
Bromine (Br) 40039-93-8 0.003282 10000 6580.23632812
Silica (SiO2) 60676-86-0 0.236334 720000 473837.15625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.009847 30000 19742.7148438
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000000 0 0
Encapsulation Total: 0.328241 1000000 658105.875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000286 1000000 573.414855957
  TOTAL MASS (g): 0.498766