LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1630CN8#PBF (Engineering Calculation) PDIP  
(printed on: 2020-06-01 23:21:50) TOTAL MASS (g): 0.501798
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.004397 1000000 8762.484375
Die Coat Dow Corning Silicone 69430-27-9 0.000245 1000000 488.24395752
Lead Frame Cu Copper (Cu) 7440-50-8 0.149760 975000 298446.5625
Iron (Fe) 7439-89-6 0.003686 24000 7345.58007812
Phosphorus (P) 7723-14-0 0.000046 300 91.6702957153
Zinc (Zn) 7440-66-6 0.000108 700 215.225906372
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.153600 1000000 306099.09375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.012410 1000000 24731.6308594
External Plating Total: 0.012410 1000000 24731.6308594
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.001228 1000000 2447.19848633
Internal Plating Total: 0.001228 1000000 2447.19848633
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001189 750000 2369.47753906
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000396 250000 789.161682129
Die Attach Total: 0.001585 1000000 3158.6394043
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.044286 135000 88254.578125
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.282121 860000 562219.9375
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.001640 5000 3268.24536133
Encapsulation Total: 0.328047 1000000 653742.75
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000286 1000000 569.950073242
  TOTAL MASS (g): 0.501798