LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1634AIS8-5#PBF (Engineering Calculation) SOIC  
(printed on: 2020-06-01 21:39:35) TOTAL MASS (g): 0.073042
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001763 1000000 24136.8496094
Die Coat Dow Corning Silicone 69430-27-9 0.000073 1000000 999.427062988
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.014071 580000 192642.984375
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.010189 420000 139495.375
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.024260 1000000 332138.375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001477 1000000 20219.2597656
External Plating Total: 0.001477 1000000 20219.2597656
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000194 1000000 2656.01171875
Internal Plating Total: 0.000194 1000000 2656.01171875
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000638 750000 8734.71875
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000213 250000 2916.13647461
Die Attach Total: 0.000851 1000000 11650.8554688
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006636 150000 90852.0234375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036276 820000 496646.8125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001106 25000 15142.0048828
Carbon Black (C) 1333-86-4 0.000221 5000 3025.66259766
Encapsulation Total: 0.044239 1000000 605666.4375
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000185 1000000 2532.79467773
  TOTAL MASS (g): 0.073042