LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1638CS8#TRPBF (Engineering Calculation) SOIC  
(printed on: 2020-06-01 22:05:23) TOTAL MASS (g): 0.073781
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002348 1000000 31823.9746094
Die Coat Dow Corning Silicone 69430-27-9 0.000098 1000000 1328.25793457
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.014071 580000 190713.4375
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.010189 420000 138098.171875
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.024260 1000000 328811.625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001477 1000000 20016.7382812
External Plating Total: 0.001477 1000000 20016.7382812
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000194 1000000 2629.40869141
Internal Plating Total: 0.000194 1000000 2629.40869141
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000770 750000 10436.3125
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000257 250000 3483.28857422
Die Attach Total: 0.001027 1000000 13919.6015625
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006629 150000 89847.1640625
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036237 820000 491143.71875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001105 25000 14976.7861328
Carbon Black (C) 1333-86-4 0.000221 5000 2995.35717773
Encapsulation Total: 0.044192 1000000 598963
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000185 1000000 2507.42553711
  TOTAL MASS (g): 0.073781