LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1767EMS8#TRPBF (Engineering Calculation) MSOP  
(printed on: 2020-07-10 06:34:26) TOTAL MASS (g): 0.026585
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001482 1000000 55745.6679688
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.010433 975000 392438.9375
Iron (Fe) 7439-89-6 0.000257 24000 9667.09667969
Phosphorus (P) 7723-14-0 0.000003 300 112.845481873
Zinc (Zn) 7440-66-6 0.000007 700 263.306152344
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.010700 1000000 402482.25
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000710 1000000 26707.703125
External Plating Total: 0.000710 1000000 26707.703125
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000086 1000000 3234.90380859
Internal Plating Total: 0.000086 1000000 3234.90380859
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000568 750000 21365.4121094
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000189 250000 7109.26513672
Die Attach Total: 0.000757 1000000 28474.6757812
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001659 130000 62403.546875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.010591 830000 398382.1875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000447 35000 16813.9765625
Carbon Black (C) 1333-86-4 0.000064 5000 2407.37011719
Encapsulation Total: 0.012761 1000000 480007.0625
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000089 1000000 3347.74926758
  TOTAL MASS (g): 0.026585