LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1790BCS6-5#TRMPBF (Engineering Calculation) TSOT-23  
(printed on: 2020-07-10 04:36:58) TOTAL MASS (g): 0.012543
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000567 1000000 45205.3789062
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.002726 580000 217336.609375
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.001974 420000 157381.671875
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.004700 1000000 374718.28125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000644 1000000 51324.921875
External Plating Total: 0.000644 1000000 51324.921875
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000080 1000000 6378.18310547
Internal Plating Total: 0.000080 1000000 6378.18310547
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000409 750000 32608.4648438
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000136 250000 10842.9121094
Die Attach Total: 0.000545 1000000 43451.375
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.000772 130000 61549.46875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.004930 830000 393055.53125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000208 35000 16583.2773438
Carbon Black (C) 1333-86-4 0.000030 5000 2391.81860352
Encapsulation Total: 0.005940 1000000 473580.125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000067 1000000 5341.72851562
  TOTAL MASS (g): 0.012543