LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1963AIQ#PBF (Engineering Calculation) DDPAK  
(printed on: 2020-06-01 22:58:16) TOTAL MASS (g): 1.397064
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.003006 1000000 2151.65478516
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.852419 998500 610150.1875
Iron (Fe) 7439-89-6 0.000000 0 0
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.001281 1500 916.922729492
Lead Frame Total: 0.853700 1000000 611067.125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.009978 1000000 7142.27587891
External Plating Total: 0.009978 1000000 7142.27587891
Inter. Plating Ni 7440-02-0 0.004000 740740.75 2863.14697266
Inter. Plating Ag 7440-22-4 0.001400 259259.265625 1002.10131836
Internal Plating Total: 0.005400 1000000 3865.24829102
Die Attach 95Pb / 5 Sn Silver (Ag) 7440-22-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000080 50000 57.2629356384
Lead (Pb) 7439-92-1 0.001512 950000 1082.26953125
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000000 0 0
Die Attach Total: 0.001592 1000000 1139.5324707
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.053704 103000 38440.609375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.466653 895000 334024
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.001043 2000 746.565551758
Encapsulation Total: 0.521400 1000000 373211.1875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.001988 1000000 1422.98388672
  TOTAL MASS (g): 1.397064