LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1965HQ#PBF (Engineering Calculation) DDPAK  
(printed on: 2020-06-01 23:23:40) TOTAL MASS (g): 1.39588
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002147 1000000 1538.09765625
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.852419 998500 610667.75
Iron (Fe) 7439-89-6 0.000000 0 0
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.001281 1500 917.700500488
Lead Frame Total: 0.853700 1000000 611585.4375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.009978 1000000 7148.33398438
External Plating Total: 0.009978 1000000 7148.33398438
Inter. Plating Ni 7440-02-0 0.004000 740740.75 2865.57543945
Inter. Plating Ag 7440-22-4 0.001400 259259.265625 1002.95129395
Internal Plating Total: 0.005400 1000000 3868.52685547
Die Attach 95Pb / 5 Sn Silver (Ag) 7440-22-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000063 50000 45.1328125
Lead (Pb) 7439-92-1 0.001204 950000 862.538146973
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000000 0 0
Die Attach Total: 0.001267 1000000 907.671020508
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.053704 103000 38473.2148438
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.466653 895000 334307.34375
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.001043 2000 747.198791504
Encapsulation Total: 0.521400 1000000 373527.75
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.001988 1000000 1424.19091797
  TOTAL MASS (g): 1.395880