LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1991IMS#PBF (Engineering Calculation) MSOP  
(printed on: 2020-05-29 00:54:37) TOTAL MASS (g): 0.027792
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002387 1000000 85887.9453125
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.010433 975000 375395.4375
Iron (Fe) 7439-89-6 0.000257 24000 9247.2578125
Phosphorus (P) 7723-14-0 0.000003 300 107.944641113
Zinc (Zn) 7440-66-6 0.000007 700 251.870803833
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.010700 1000000 385002.5625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000710 1000000 25547.7949219
External Plating Total: 0.000710 1000000 25547.7949219
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000086 1000000 3094.4128418
Internal Plating Total: 0.000086 1000000 3094.4128418
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000778 750000 27993.6425781
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000259 250000 9319.21972656
Die Attach Total: 0.001037 1000000 37312.8632812
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001314 103000 47279.75
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.011420 895000 410909.25
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000026 2000 935.520141602
Encapsulation Total: 0.012760 1000000 459124.5
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000112 1000000 4029.93286133
  TOTAL MASS (g): 0.027792