LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1994CMS8#TRPBF (Engineering Calculation) MSOP  
(printed on: 2020-05-29 00:44:33) TOTAL MASS (g): 0.026612
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001460 1000000 54862.4140625
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.006206 580000 233202.84375
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.004494 420000 168871.03125
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.010700 1000000 402073.875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000710 1000000 26680.6054688
External Plating Total: 0.000710 1000000 26680.6054688
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000086 1000000 3231.62158203
Internal Plating Total: 0.000086 1000000 3231.62158203
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000558 750000 20967.9648438
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000186 250000 6989.32128906
Die Attach Total: 0.000744 1000000 27957.2851562
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001659 130000 62340.234375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.010591 830000 397977.96875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000447 35000 16796.9160156
Carbon Black (C) 1333-86-4 0.000064 5000 2404.92773438
Encapsulation Total: 0.012761 1000000 479520.03125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000151 1000000 5674.12597656
  TOTAL MASS (g): 0.026612