LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3008ITS8-3.3#TRMPBF (Engineering Calculation) TSOT-23  
(printed on: 2020-07-10 06:31:42) TOTAL MASS (g): 0.012407
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000429 1000000 34578.1171875
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.004582 975000 369316.875
Iron (Fe) 7439-89-6 0.000113 24000 9107.98925781
Phosphorus (P) 7723-14-0 0.000001 300 80.6016769409
Zinc (Zn) 7440-66-6 0.000003 700 241.805023193
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.004699 1000000 378747.28125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000663 1000000 53413.921875
External Plating Total: 0.000663 1000000 53413.921875
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000080 1000000 6448.13378906
Internal Plating Total: 0.000080 1000000 6448.13378906
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000351 750000 28291.1875
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000117 250000 9430.39648438
Die Attach Total: 0.000468 1000000 37721.5859375
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.000777 130000 62627.5
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.004963 830000 400026.125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000209 35000 16845.75
Carbon Black (C) 1333-86-4 0.000030 5000 2418.05004883
Encapsulation Total: 0.005979 1000000 481917.40625
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000089 1000000 7173.54931641
  TOTAL MASS (g): 0.012407