LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3010EMS8E-5#TRPBF (Engineering Calculation) MSOP-Exposed  
(printed on: 2020-04-04 14:37:39) TOTAL MASS (g): 0.027396
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002103 1000000 76762.9609375
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.010433 975000 380821.65625
Iron (Fe) 7439-89-6 0.000257 24000 9380.92382812
Phosphorus (P) 7723-14-0 0.000003 300 109.504936218
Zinc (Zn) 7440-66-6 0.000007 700 255.511520386
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.010700 1000000 390567.625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000710 1000000 25917.0800781
External Plating Total: 0.000710 1000000 25917.0800781
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000086 1000000 3139.14160156
Internal Plating Total: 0.000086 1000000 3139.14160156
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000711 750000 25952.6699219
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000237 250000 8650.88964844
Die Attach Total: 0.000948 1000000 34603.5585938
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001314 103000 47963.1601562
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.011420 895000 416848.8125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000026 2000 949.042785645
Encapsulation Total: 0.012760 1000000 465761
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000089 1000000 3248.64648438
  TOTAL MASS (g): 0.027396