LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3021ES8-1.8#PBF (Engineering Calculation) SOIC  
(printed on: 2020-06-01 21:54:34) TOTAL MASS (g): 0.076673
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.004546 1000000 59290.8710938
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.023653 975000 308492.5
Iron (Fe) 7439-89-6 0.000582 24000 7590.69189453
Phosphorus (P) 7723-14-0 0.000007 300 91.2969818115
Zinc (Zn) 7440-66-6 0.000017 700 221.721252441
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.024259 1000000 316396.21875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001477 1000000 19261.7324219
External Plating Total: 0.001477 1000000 19261.7324219
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000194 1000000 2530.23046875
Internal Plating Total: 0.000194 1000000 2530.23046875
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001223 750000 15950.8867188
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000408 250000 5321.31005859
Die Attach Total: 0.001631 1000000 21272.1953125
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006657 150000 86823.4375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036392 820000 474639.9375
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001110 25000 14477.0917969
Carbon Black (C) 1333-86-4 0.000222 5000 2895.41845703
Encapsulation Total: 0.044381 1000000 578835.875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000185 1000000 2412.84887695
  TOTAL MASS (g): 0.076673