LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3042IDD#TRPBF (Engineering Calculation) DFN 3mm X 3mm Exp. Pad  
(printed on: 2020-07-10 07:17:54) TOTAL MASS (g): 0.022925
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001326 1000000 57839.8710938
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.009711 975000 423592
Iron (Fe) 7439-89-6 0.000239 24000 10425.1357422
Phosphorus (P) 7723-14-0 0.000003 300 130.859436035
Zinc (Zn) 7440-66-6 0.000007 700 305.3387146
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.009960 1000000 434453.375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000455 1000000 19862.8359375
External Plating Total: 0.000455 1000000 19862.8359375
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000225 1000000 9814.45800781
Internal Plating Total: 0.000225 1000000 9814.45800781
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000338 820000 14743.4980469
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000074 180000 3227.86621094
Die Attach Total: 0.000412 1000000 17971.3632812
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001362 130000 59410.1835938
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.009013 860000 393145.375
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000105 10000 4580.08056641
Encapsulation Total: 0.010480 1000000 457135.625
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000067 1000000 2922.52758789
  TOTAL MASS (g): 0.022925