LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3062EDCB#TRMPBF (Engineering Calculation) DFN 2mm X 3mm Exp. Pad  
(printed on: 2020-06-01 23:04:41) TOTAL MASS (g): 0.01493
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000775 1000000 51907.71875
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.005723 975000 383313.34375
Iron (Fe) 7439-89-6 0.000141 24000 9443.85449219
Phosphorus (P) 7723-14-0 0.000002 300 133.955383301
Zinc (Zn) 7440-66-6 0.000004 700 267.910766602
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.005870 1000000 393159.09375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000260 1000000 17437.140625
External Plating Total: 0.000260 1000000 17437.140625
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000136 1000000 9108.96679688
Internal Plating Total: 0.000136 1000000 9108.96679688
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000198 800000 13261.5839844
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000049 200000 3281.90698242
Die Attach Total: 0.000247 1000000 16543.4902344
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.000989 130000 66240.9375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.006545 860000 438369
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000076 10000 5090.3046875
Encapsulation Total: 0.007610 1000000 509700.3125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000032 1000000 2143.28613281
  TOTAL MASS (g): 0.014930