LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3070EUFD#TRPBF (Engineering Calculation) QFN 4mm X 5mm Exp. Pad  
(printed on: 2020-06-01 23:16:13) TOTAL MASS (g): 0.05438
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002530 1000000 46524.34375
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.023546 975000 432989
Iron (Fe) 7439-89-6 0.000580 24000 10665.6601562
Phosphorus (P) 7723-14-0 0.000007 300 128.723480225
Zinc (Zn) 7440-66-6 0.000017 700 312.61416626
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.024150 1000000 444096.03125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001152 1000000 21186.6660156
External Plating Total: 0.001152 1000000 21186.6660156
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000529 1000000 9727.81738281
Internal Plating Total: 0.000529 1000000 9727.81738281
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001079 750000 19841.8027344
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000360 250000 6620.06494141
Die Attach Total: 0.001439 1000000 26461.8691406
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.003134 130000 57631.34375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.020735 860000 381297.3125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000241 10000 4431.765625
Encapsulation Total: 0.024110 1000000 443360.4375
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000470 1000000 8642.86230469
  TOTAL MASS (g): 0.054380