LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3086IDHD#PBF (Engineering Calculation) DFN 5mm X 4mm Exp. Pad  
(printed on: 2020-05-31 12:23:25) TOTAL MASS (g): 0.053579
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.003341 1000000 62356.828125
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.023117 975000 431458.5
Iron (Fe) 7439-89-6 0.000569 24000 10619.8857422
Phosphorus (P) 7723-14-0 0.000007 300 130.648849487
Zinc (Zn) 7440-66-6 0.000017 700 317.29006958
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.023710 1000000 442526.3125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001124 1000000 20973.4863281
External Plating Total: 0.001124 1000000 20973.4863281
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000522 1000000 9742.671875
Internal Plating Total: 0.000522 1000000 9742.671875
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000652 820000 12169.0068359
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000143 180000 2668.96923828
Die Attach Total: 0.000795 1000000 14837.9765625
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.003117 130000 58176.0664062
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.020623 860000 384910.15625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000240 10000 4479.38916016
Encapsulation Total: 0.023980 1000000 447565.625
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000107 1000000 1997.06103516
  TOTAL MASS (g): 0.053579