LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3469ETS8#TRMPBF (Engineering Calculation) TSOT-23  
(printed on: 2020-07-10 04:40:05) TOTAL MASS (g): 0.012717
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000583 1000000 45845.2617188
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.004582 975000 360313.90625
Iron (Fe) 7439-89-6 0.000113 24000 8885.95996094
Phosphorus (P) 7723-14-0 0.000001 300 78.6368103027
Zinc (Zn) 7440-66-6 0.000003 700 235.910461426
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.004699 1000000 369514.40625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000663 1000000 52111.828125
External Plating Total: 0.000663 1000000 52111.828125
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000080 1000000 6290.9453125
Internal Plating Total: 0.000080 1000000 6290.9453125
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000468 750000 36802.03125
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000156 250000 12267.3427734
Die Attach Total: 0.000624 1000000 49069.3710938
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.000777 130000 61100.8046875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.004963 830000 390274.5
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000209 35000 16435.09375
Carbon Black (C) 1333-86-4 0.000030 5000 2359.10424805
Encapsulation Total: 0.005979 1000000 470169.5
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000089 1000000 6998.67675781
  TOTAL MASS (g): 0.012717