LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3478EFE#PBF (Engineering Calculation) TSSOP Exp. Pad  
(printed on: 2020-05-28 23:26:11) TOTAL MASS (g): 0.060666
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.004256 1000000 70154.4296875
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.018525 975000 305359.71875
Iron (Fe) 7439-89-6 0.000456 24000 7516.546875
Phosphorus (P) 7723-14-0 0.000006 300 98.9019317627
Zinc (Zn) 7440-66-6 0.000013 700 214.287506104
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.019000 1000000 313189.40625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.002537 1000000 41821.5976562
External Plating Total: 0.002537 1000000 41821.5976562
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000250 1000000 4120.91357422
Internal Plating Total: 0.000250 1000000 4120.91357422
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001156 750000 19055.1035156
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000385 250000 6346.20654297
Die Attach Total: 0.001541 1000000 25401.3105469
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.004388 135000 72330.2734375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.027950 860000 460718.15625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000163 5000 2686.8359375
Encapsulation Total: 0.032501 1000000 535735.25
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000581 1000000 9577.00292969
  TOTAL MASS (g): 0.060666