LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3754IUH#PBF (Engineering Calculation) QFN 5mm X 5mm Exp. Pad  
(printed on: 2020-02-27 00:32:43) TOTAL MASS (g): 0.065722
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002941 1000000 44748.9101562
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.028382 975000 431847.5
Iron (Fe) 7439-89-6 0.000699 24000 10635.6650391
Phosphorus (P) 7723-14-0 0.000009 300 136.939880371
Zinc (Zn) 7440-66-6 0.000020 700 304.310852051
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.029110 1000000 442924.4375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001398 1000000 21275.5253906
External Plating Total: 0.001398 1000000 21275.5253906
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000635 1000000 9661.86914062
Internal Plating Total: 0.000635 1000000 9661.86914062
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001201 750000 18273.8652344
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000400 250000 6086.21679688
Die Attach Total: 0.001601 1000000 24360.0839844
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.003888 130000 59158.0273438
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.025723 860000 391389.375
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000299 10000 4549.44726562
Encapsulation Total: 0.029910 1000000 455096.875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000127 1000000 1932.37402344
  TOTAL MASS (g): 0.065722