LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3760IFE#PBF (Engineering Calculation) TSSOP Exp. Pad  
(printed on: 2020-02-27 00:06:27) TOTAL MASS (g): 0.092681
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001454 1000000 15688.1601562
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.030596 975000 330120.3125
Iron (Fe) 7439-89-6 0.000753 24000 8124.61132812
Phosphorus (P) 7723-14-0 0.000009 300 97.1069107056
Zinc (Zn) 7440-66-6 0.000022 700 237.372436523
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.031380 1000000 338579.4375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.002480 1000000 26762.1660156
External Plating Total: 0.002480 1000000 26762.1660156
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000806 1000000 8696.46386719
Internal Plating Total: 0.000806 1000000 8696.46386719
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000558 750000 6020.62841797
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000186 250000 2006.87634277
Die Attach Total: 0.000744 1000000 8027.50537109
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.007460 135000 80490.8359375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.047524 860000 512767.6875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000276 5000 2977.9453125
Encapsulation Total: 0.055260 1000000 596236.4375
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000557 1000000 6009.83837891
  TOTAL MASS (g): 0.092681