LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3956EUHE#TRPBF (Engineering Calculation) QFN 5mm X 6mm Exp. Pad  
(printed on: 2020-06-01 22:58:45) TOTAL MASS (g): 0.067477
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000862 1000000 12774.6943359
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.025794 975000 382262.71875
Iron (Fe) 7439-89-6 0.000635 24000 9410.59277344
Phosphorus (P) 7723-14-0 0.000008 300 118.558654785
Zinc (Zn) 7440-66-6 0.000019 700 281.576782227
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.026456 1000000 392073.4375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001276 1000000 18912.3535156
External Plating Total: 0.001276 1000000 18912.3535156
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000573 1000000 8491.76269531
Internal Plating Total: 0.000573 1000000 8491.76269531
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000518 750000 7676.67236328
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000173 250000 2563.83081055
Die Attach Total: 0.000691 1000000 10240.5039062
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.004876 130000 72261.5
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.032257 860000 478043.3125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000375 10000 5557.43701172
Encapsulation Total: 0.037508 1000000 555862.25
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000111 1000000 1645.0012207
  TOTAL MASS (g): 0.067477