LINEAR TECHNOLOGY MATERIALS DECLARATION

LT5526EUF#PBF (Engineering Calculation) QFN 4mm X 4mm Exp. Pad  
(printed on: 2020-07-10 06:38:30) TOTAL MASS (g): 0.035822
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000734 1000000 20490.0175781
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.012129 975000 338587.75
Iron (Fe) 7439-89-6 0.000299 24000 8346.75
Phosphorus (P) 7723-14-0 0.000004 300 111.662216187
Zinc (Zn) 7440-66-6 0.000009 700 251.239974976
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.012441 1000000 347297.40625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000580 1000000 16200.1533203
External Plating Total: 0.000580 1000000 16200.1533203
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000278 1000000 7760.5234375
Internal Plating Total: 0.000278 1000000 7760.5234375
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000465 750000 12980.7324219
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000155 250000 4326.91064453
Die Attach Total: 0.000620 1000000 17307.6425781
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.002739 130000 76460.6953125
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.018120 860000 505829.8125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000211 10000 5890.18164062
Encapsulation Total: 0.021070 1000000 588180.75
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000099 1000000 2763.63964844
  TOTAL MASS (g): 0.035822