LINEAR TECHNOLOGY MATERIALS DECLARATION

LT6012CS#TRPBF (Engineering Calculation) SOIC  
(printed on: 2020-05-29 01:05:33) TOTAL MASS (g): 0.13637
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.005004 1000000 36694.1640625
Die Coat Dow Corning Silicone 69430-27-9 0.000208 1000000 1525.25708008
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.025972 580000 190451.8125
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.018808 420000 137918.4375
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.044780 1000000 328370.28125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.002585 1000000 18958.9277344
External Plating Total: 0.002585 1000000 18958.9277344
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000358 1000000 2625.20214844
Internal Plating Total: 0.000358 1000000 2625.20214844
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001323 750000 9701.51464844
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000441 250000 3233.83862305
Die Attach Total: 0.001764 1000000 12935.3544922
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.010571 130000 77516.796875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.067494 830000 494931.25
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.002846 35000 20869.6230469
Carbon Black (C) 1333-86-4 0.000407 5000 2984.51782227
Encapsulation Total: 0.081318 1000000 596302.1875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000353 1000000 2588.53735352
  TOTAL MASS (g): 0.136370