LINEAR TECHNOLOGY MATERIALS DECLARATION

LT6108HDCB-2#TRMPBF (Engineering Calculation) DFN 2mm X 3mm Exp. Pad  
(printed on: 2020-07-10 06:30:48) TOTAL MASS (g): 0.015575
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000939 1000000 60287.5976562
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.005723 975000 367439.75
Iron (Fe) 7439-89-6 0.000141 24000 9052.77050781
Phosphorus (P) 7723-14-0 0.000002 300 128.408096313
Zinc (Zn) 7440-66-6 0.000004 700 256.816192627
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.005870 1000000 376877.71875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000260 1000000 16715.0410156
External Plating Total: 0.000260 1000000 16715.0410156
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000136 1000000 8731.75
Internal Plating Total: 0.000136 1000000 8731.75
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000546 750000 35055.4101562
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000182 250000 11685.1367188
Die Attach Total: 0.000728 1000000 46740.546875
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.000989 130000 63497.796875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.006545 860000 420215.46875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000076 10000 4879.50732422
Encapsulation Total: 0.007610 1000000 488592.8125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000032 1000000 2054.52954102
  TOTAL MASS (g): 0.015575