LINEAR TECHNOLOGY MATERIALS DECLARATION

LT8606IMSE#PBF (Engineering Calculation) MSOP-Exposed  
(printed on: 2020-06-01 22:59:44) TOTAL MASS (g): 0.02621
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001129 1000000 43075.1210938
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.010433 975000 398053.78125
Iron (Fe) 7439-89-6 0.000257 24000 9805.40820312
Phosphorus (P) 7723-14-0 0.000003 300 114.460021973
Zinc (Zn) 7440-66-6 0.000007 700 267.073394775
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.010700 1000000 408240.75
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000710 1000000 27089.8242188
External Plating Total: 0.000710 1000000 27089.8242188
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000086 1000000 3281.18725586
Internal Plating Total: 0.000086 1000000 3281.18725586
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000476 750000 18160.9902344
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000159 250000 6066.38085938
Die Attach Total: 0.000635 1000000 24227.3710938
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001723 135000 65738.203125
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.010974 860000 418694.75
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000064 5000 2441.8137207
Encapsulation Total: 0.012761 1000000 486874.75
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000189 1000000 7210.98095703
  TOTAL MASS (g): 0.026210