LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC1144CN8#PBF (Engineering Calculation) PDIP  
(printed on: 2020-06-01 21:48:23) TOTAL MASS (g): 0.500362
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.003274 1000000 6543.25830078
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.149760 975000 299303.09375
Iron (Fe) 7439-89-6 0.003686 24000 7366.66162109
Phosphorus (P) 7723-14-0 0.000046 300 91.933380127
Zinc (Zn) 7440-66-6 0.000108 700 215.843582153
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.153600 1000000 306977.5625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.012410 1000000 24802.6074219
External Plating Total: 0.012410 1000000 24802.6074219
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.001228 1000000 2454.22143555
Internal Plating Total: 0.001228 1000000 2454.22143555
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000961 750000 1920.6081543
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000320 250000 639.536560059
Die Attach Total: 0.001281 1000000 2560.14477539
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.044334 135000 88603.796875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.282424 860000 564439
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.001642 5000 3281.62207031
Encapsulation Total: 0.328400 1000000 656324.3125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000169 1000000 337.755249023
  TOTAL MASS (g): 0.500362