LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC1487CS8#TRPBF (Engineering Calculation) SOIC  
(printed on: 2020-04-04 13:11:03) TOTAL MASS (g): 0.07357
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002181 1000000 29645.296875
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.023653 975000 321504
Iron (Fe) 7439-89-6 0.000582 24000 7910.84960938
Phosphorus (P) 7723-14-0 0.000007 300 95.1476745605
Zinc (Zn) 7440-66-6 0.000017 700 231.072937012
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.024259 1000000 329741.0625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001477 1000000 20074.1484375
External Plating Total: 0.001477 1000000 20074.1484375
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000194 1000000 2636.94970703
Internal Plating Total: 0.000194 1000000 2636.94970703
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000727 750000 9881.765625
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000242 250000 3289.39086914
Die Attach Total: 0.000969 1000000 13171.15625
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006657 150000 90485.4375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036392 820000 494659.15625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001110 25000 15087.7021484
Carbon Black (C) 1333-86-4 0.000222 5000 3017.54052734
Encapsulation Total: 0.044381 1000000 603249.875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000109 1000000 1481.58520508
  TOTAL MASS (g): 0.073570