LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC1595AIS8#PBF (Engineering Calculation) SOIC  
(printed on: 2020-04-04 14:22:21) TOTAL MASS (g): 0.074191
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.004583 1000000 61773.1132812
Die Coat Dow Corning Silicone 69430-27-9 0.000191 1000000 2574.44116211
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.012824 580000 172851.484375
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.009286 420000 125163.671875
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.022110 1000000 298015.1875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001477 1000000 19906.1191406
External Plating Total: 0.001477 1000000 19906.1191406
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000068 1000000 916.554992676
Internal Plating Total: 0.000068 1000000 916.554992676
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001231 750000 16592.3398438
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000410 250000 5526.28759766
Die Attach Total: 0.001641 1000000 22118.6308594
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006602 150000 88986.7109375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036090 820000 486448.09375
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001100 25000 14826.625
Carbon Black (C) 1333-86-4 0.000220 5000 2965.32495117
Encapsulation Total: 0.044012 1000000 593226.75
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000109 1000000 1469.18383789
  TOTAL MASS (g): 0.074191