LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC1662IMS8#PBF (Engineering Calculation) MSOP  
(printed on: 2020-05-29 00:19:30) TOTAL MASS (g): 0.027591
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002252 1000000 81620.734375
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.006206 580000 224928.21875
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.004494 420000 162879.0625
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.010700 1000000 387807.28125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000710 1000000 25733.9101562
External Plating Total: 0.000710 1000000 25733.9101562
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000086 1000000 3116.95556641
Internal Plating Total: 0.000086 1000000 3116.95556641
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000745 750000 27001.5332031
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000248 250000 8988.4296875
Die Attach Total: 0.000993 1000000 35989.9609375
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001659 130000 60128.2460938
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.010591 830000 383856.71875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000447 35000 16200.9208984
Carbon Black (C) 1333-86-4 0.000064 5000 2319.59472656
Encapsulation Total: 0.012761 1000000 462505.46875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000089 1000000 3225.68652344
  TOTAL MASS (g): 0.027591