LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC1860CS8#PBF (Engineering Calculation) SOIC  
(printed on: 2020-05-28 22:55:27) TOTAL MASS (g): 0.073661
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002244 1000000 30463.9453125
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.023653 975000 321106.8125
Iron (Fe) 7439-89-6 0.000582 24000 7901.07617188
Phosphorus (P) 7723-14-0 0.000007 300 95.030128479
Zinc (Zn) 7440-66-6 0.000017 700 230.787460327
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.024259 1000000 329333.6875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.001477 1000000 20049.3457031
External Plating Total: 0.001477 1000000 20049.3457031
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000194 1000000 2633.69189453
Internal Plating Total: 0.000194 1000000 2633.69189453
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000748 750000 10154.6474609
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000249 250000 3380.35742188
Die Attach Total: 0.000997 1000000 13535.0058594
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006657 150000 90373.6484375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036392 820000 494048.0625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001110 25000 15069.0625
Carbon Black (C) 1333-86-4 0.000222 5000 3013.81274414
Encapsulation Total: 0.044381 1000000 602504.625
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000109 1000000 1479.75476074
  TOTAL MASS (g): 0.073661