LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2309IUF#TRPBF (Engineering Calculation) QFN 4mm X 4mm Exp. Pad  
(printed on: 2020-06-01 23:09:28) TOTAL MASS (g): 0.040515
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001708 1000000 42157.7382812
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.015961 975000 393957.6875
Iron (Fe) 7439-89-6 0.000393 24000 9700.22949219
Phosphorus (P) 7723-14-0 0.000005 300 123.412582397
Zinc (Zn) 7440-66-6 0.000011 700 271.50769043
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.016370 1000000 404052.8125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000773 1000000 19067.421875
External Plating Total: 0.000773 1000000 19067.421875
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000362 1000000 8935.0703125
Internal Plating Total: 0.000362 1000000 8935.0703125
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000815 750000 20116.25
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000272 250000 6713.64453125
Die Attach Total: 0.001087 1000000 26829.8964844
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.002616 130000 64569.4648438
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.017303 860000 427081.59375
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000201 10000 4961.18603516
Encapsulation Total: 0.020120 1000000 496612.25
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000095 1000000 2344.83935547
  TOTAL MASS (g): 0.040515