LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2704CGW-16#PBF (Engineering Calculation) SSOP  
(printed on: 2020-04-04 14:21:23) TOTAL MASS (g): 0.778352
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.025475 1000000 32729.4101562
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.275671 975000 354172.71875
Iron (Fe) 7439-89-6 0.006786 24000 8718.421875
Phosphorus (P) 7723-14-0 0.000085 300 109.205101013
Zinc (Zn) 7440-66-6 0.000198 700 254.383636475
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.282740 1000000 363254.71875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.012932 1000000 16614.4921875
External Plating Total: 0.012932 1000000 16614.4921875
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.002260 1000000 2903.57080078
Internal Plating Total: 0.002260 1000000 2903.57080078
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.004602 750000 5912.49316406
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.001534 250000 1970.83105469
Die Attach Total: 0.006136 1000000 7883.32421875
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.060440 135000 77651.2578125
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.385022 860000 494663.15625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.002239 5000 2876.59082031
Encapsulation Total: 0.447701 1000000 575191
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.001108 1000000 1423.52075195
  TOTAL MASS (g): 0.778352