LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2802IDE#TRPBF (Engineering Calculation) DFN 4mm X 3mm Exp. Pad  
(printed on: 2020-02-27 00:33:54) TOTAL MASS (g): 0.031114
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001529 1000000 49142.125
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.012783 975000 410846.1875
Iron (Fe) 7439-89-6 0.000315 24000 10124.1142578
Phosphorus (P) 7723-14-0 0.000004 300 128.560180664
Zinc (Zn) 7440-66-6 0.000009 700 289.260406494
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.013111 1000000 421388.09375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000607 1000000 19503.6914062
External Plating Total: 0.000607 1000000 19503.6914062
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000295 1000000 9481.3125
Internal Plating Total: 0.000295 1000000 9481.3125
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000753 750000 24201.4511719
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000251 250000 8067.15039062
Die Attach Total: 0.001004 1000000 32268.6015625
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001888 130000 60680.40625
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.012487 860000 401332.71875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000145 10000 4660.30615234
Encapsulation Total: 0.014520 1000000 466673.40625
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000048 1000000 1542.72216797
  TOTAL MASS (g): 0.031114