LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2851HDD#PBF (Engineering Calculation) DFN 3mm X 3mm Exp. Pad  
(printed on: 2020-05-28 23:50:19) TOTAL MASS (g): 0.023369
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001553 1000000 66454.4921875
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.009350 975000 400096.28125
Iron (Fe) 7439-89-6 0.000230 24000 9841.94042969
Phosphorus (P) 7723-14-0 0.000003 300 128.373138428
Zinc (Zn) 7440-66-6 0.000007 700 299.537322998
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.009590 1000000 410366.125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000437 1000000 18715.75
External Plating Total: 0.000437 1000000 18715.75
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000218 1000000 9328.44824219
Internal Plating Total: 0.000218 1000000 9328.44824219
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000764 750000 32692.3574219
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000255 250000 10911.7158203
Die Attach Total: 0.001019 1000000 43604.0703125
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001368 130000 58538.1484375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.009047 860000 387130.5625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000105 10000 4493.05957031
Encapsulation Total: 0.010520 1000000 450161.78125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000032 1000000 1369.31347656
  TOTAL MASS (g): 0.023369