LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2852IMS#PBF (Engineering Calculation) MSOP  
(printed on: 2020-07-10 05:30:37) TOTAL MASS (g): 0.027718
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002330 1000000 84060.8203125
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.010433 975000 376397.625
Iron (Fe) 7439-89-6 0.000257 24000 9271.9453125
Phosphorus (P) 7723-14-0 0.000003 300 108.232818604
Zinc (Zn) 7440-66-6 0.000007 700 252.543243408
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.010700 1000000 386030.375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000710 1000000 25616
External Plating Total: 0.000710 1000000 25616
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000086 1000000 3102.67382812
Internal Plating Total: 0.000086 1000000 3102.67382812
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000764 750000 27563.2910156
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000255 250000 9199.7890625
Die Attach Total: 0.001019 1000000 36763.078125
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001659 130000 59852.7460938
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.010591 830000 382097.9375
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000447 35000 16126.6884766
Carbon Black (C) 1333-86-4 0.000064 5000 2308.96679688
Encapsulation Total: 0.012761 1000000 460386.3125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000112 1000000 4040.69189453
  TOTAL MASS (g): 0.027718