LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2901-1CGN#PBF (Engineering Calculation) SSOP  
(printed on: 2020-05-28 23:48:31) TOTAL MASS (g): 0.080465
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001930 1000000 23985.5625
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.029933 975000 371999.90625
Iron (Fe) 7439-89-6 0.000737 24000 9159.25390625
Phosphorus (P) 7723-14-0 0.000009 300 111.849777222
Zinc (Zn) 7440-66-6 0.000021 700 260.982818604
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.030700 1000000 381532
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.002272 1000000 28236.8515625
External Plating Total: 0.002272 1000000 28236.8515625
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000246 1000000 3057.22729492
Internal Plating Total: 0.000246 1000000 3057.22729492
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000681 750000 8463.29980469
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000227 250000 2821.09960938
Die Attach Total: 0.000908 1000000 11284.3984375
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.006623 150000 82309.0078125
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.036203 820000 449921.9375
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.001104 25000 13720.2392578
Carbon Black (C) 1333-86-4 0.000221 5000 2746.53344727
Encapsulation Total: 0.044151 1000000 548697.6875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000258 1000000 3206.35986328
  TOTAL MASS (g): 0.080465