LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2946IMS#PBF (Engineering Calculation) MSOP  
(printed on: 2020-04-04 14:04:11) TOTAL MASS (g): 0.038299
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.003098 1000000 80889.7890625
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.013845 975000 361497.46875
Iron (Fe) 7439-89-6 0.000355 25000 9269.16601562
Phosphorus (P) 7723-14-0 0.000004 300 104.441299438
Zinc (Zn) 7440-66-6 0.000010 700 261.103240967
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.014214 1001000 371132.15625
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000710 1000000 18538.984375
External Plating Total: 0.000710 1000000 18538.984375
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000086 1000000 2245.48803711
Internal Plating Total: 0.000086 1000000 2245.48803711
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000938 750000 24491.484375
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000313 250000 8172.53173828
Die Attach Total: 0.001251 1000000 32664.015625
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.002439 130000 63683.0859375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.015571 830000 406563.875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000657 35000 17154.4824219
Carbon Black (C) 1333-86-4 0.000094 5000 2454.37060547
Encapsulation Total: 0.018761 1000000 489855.8125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000179 1000000 4673.74804688
  TOTAL MASS (g): 0.038299